Thin Silicon Wafer
Ultra-thin, High-precision Wafers for MEMS, Power and Flexible Electronics
Supwafer is a leading supplier of thin silicon wafers for research and production. Our thin silicon wafers are manufactured to strict thickness and surface quality specifications, making them ideal for MEMS, microfluidics, optoelectronics, and advanced packaging applications. Whether you need standard sizes or fully customized wafers, Supwafer can meet your requirements.
- Thickness ranges: 25 µm (extreme ultra-thin) — 500 µm (thin) (typical product tiers)
- Diameters: 2″/4″/6″/8″ (100 mm / 150 mm / 200 mm / 300 mm upon request)
- Common finishes: Double-side polished (DSP), Single-side polished (SSP), texturized (for PV)
- Typical lead time: Stock samples 3–7 days, custom orders 2–4 weeks (depends on spec & qty)
- Optional oxide/nitride coating or custom patterning.
What Is a Thin Silicon Wafer?
Thin silicon wafers are single-crystal silicon substrates processed to significantly smaller thickness than standard wafers (typical 725–825 µm for 200/300 mm). They enable reduced device thickness, lower parasitics for power devices, flexible form factors for bendable electronics, and material savings. Industry definitions vary — in this page we use:
Thin: 50–500 µm
Ultra-thin: 25–100 µm
Extreme ultra-thin: <25 µm (special processes/transfer techniques often required)
Typical Specifications
| Item | Typical Range / Options | Notes |
|---|---|---|
| Thickness tiers | 25 µm, 50 µm, 75 µm, 100 µm, 150 µm, 200 µm, 300 µm, 500 µm | Custom thickness possible |
| Diameter | 50 mm / 100 mm / 150 mm / 200 mm / 300 mm | Round or square sections |
| Surface finish | DSP, SSP, CMP epi-ready, textured | Ra: DSP <1 nm typical |
| Orientation | <100>, <111>, <110> | Specify at order |
| TTV | ≤3 µm (ultra-thin), ≤5–10 µm (thin) | Tighter on request |
| Warp / Bow | ≤5–10 µm (ultra-thin), ≤25–40 µm (thin) | Controlled via bonding/backgrind |
| Edge type | Bevel (BE), Straight Edge (SE), Chamfer (CE) | / |
Why Choose Thin Silicon Wafers?
Benefits
Reduced parasitic resistance/capacitance in power MOSFETs & diodes
Backside metallization and improved thermal path in certain packages
Lower material usage per die
Enables flexible/conformal assemblies with transfer technology
Faster thermal transient response due to lower thermal mass
Considerations
Higher fragility: requires carriers and careful handling
Warpage/TTV control becomes critical as thickness decreases
Steady-state thermal resistance dominated by package/heat spreader
Faqs:
1. What is thin silicon and how does it differ from standard silicon wafers?
A SiC (Silicon Carbide) substrate is a single – crystal wafer made of silicon carbide. It’s crucial in semiconductors because of its wide bandgap, high thermal conductivity, and high breakdown electric field. These properties enable the development of high – power, high – frequency, and high – temperature electronic devices, outperforming traditional silicon in many harsh – environment and high – performance applications.
2. What are the typical thickness ranges for thin silicon wafers?
Thin silicon wafers typically range from 10 μm to 200 μm, depending on application requirements.
3. Can thin silicon wafers withstand standard semiconductor fabrication processes?
Yes, thin silicon wafers are compatible with most conventional semiconductor processing techniques, though handling precautions are recommended.
4. What applications are thin silicon wafers commonly used for?
Applications include MEMS devices, flexible electronics, high-performance microchips, sensors, and advanced research in nanotechnology.
5. How does the electrical performance of thin silicon compare to regular silicon?
Thin silicon maintains comparable electrical properties while offering reduced thermal resistance and improved device miniaturization capabilities.
6. Are thin silicon wafers more fragile than standard wafers?
Yes, thinner wafers are mechanically more fragile, so careful handling and proper packaging are essential for transportation and lab use.
7. Can thin silicon be used for flexible electronics research?
Absolutely. Thin silicon is ideal for flexible or bendable electronic devices and experimental prototypes.
8. What surface finishes or treatments are available for thin silicon wafers?
9. How are thin silicon wafers typically packaged for shipment?
They are usually packaged in protective carriers or trays with anti-static and shock-absorbing materials to prevent cracking.
10. Are there standard sizes or diameters for thin silicon wafers?
Yes, thin silicon wafers are available in standard diameters like 50 mm, 100 mm, 150 mm, and 200 mm, but custom sizes can also be supplied.
11. What are the key benefits of using thin silicon in academic research?
Thin silicon enables high-precision experiments, device miniaturization, flexible device prototypes, and advanced thermal management.
12. Can thin silicon wafers be integrated with other semiconductor materials?
Yes, they can be combined with metals, oxides, and other semiconductor layers for heterostructures and multi-material devices.
13. How should thin silicon wafers be stored in the laboratory?
Store them in a clean, dry, and temperature-controlled environment, preferably in protective carriers to avoid contamination and mechanical stress.
14. Are thin silicon wafers compatible with MEMS fabrication processes?
Yes, thin silicon wafers are widely used in MEMS research and can be processed using standard lithography, etching, and deposition methods.
15. Where can I source high-quality thin silicon wafers for research purposes?
Thin silicon wafers can be sourced from specialized semiconductor suppliers or distributors that cater to academic and research institutions.
