Fused Silica Wafer

Fused Silica Wafers are essential substrates for advanced semiconductor research and precision applications. With exceptional thermal stability, ultra-low thermal expansion, and excellent optical transparency, they provide a reliable platform for microelectronics, photonics, and MEMS development. Their superior purity ensures minimal contamination, making them ideal for high-accuracy experiments in university laboratories and R&D facilities. Whether used for optical devices, microfabrication, or high-temperature processes, our fused silica wafers deliver consistent performance and support the innovation needs of global semiconductor professionals and academic researchers.

Fused Silica Wafer Supplier - Supwafer

As a trusted Fused Silica Wafer Supplier, Supwafer delivers ultra-high-purity (99.99% SiO₂) substrates tailored for research institutions’ critical needs. Our fused silica wafers boast exceptional thermal stability (withstanding up to 1000°C), ultra-low thermal expansion, and superior surface flatness (Ra < 0.5nm)—key for applications like photolithography, MEMS/NEMS fabrication, and optoelectronic device research.

 

We offer flexible specifications (2” to 6” diameters, 300μm to 3mm thickness) and customizations (laser-machined edges, specialized surface finishes) to match your lab’s unique projects. Every wafer undergoes rigorous quality testing via advanced metrology tools, ensuring consistency for reproducible research results.

 

Backed by 15+ years of semiconductor material expertise, Supwafer provides responsive technical support and fast lead times for small-batch research orders. Partner with us to elevate your experiments—request a sample or technical datasheet today.

 

Supwafer: Precision Fused Silica Wafers for Groundbreaking Research.

Faqs:

1. What is a fused silica wafer and why is it important in semiconductor research?

A fused silica wafer is a high-purity quartz substrate valued for its thermal stability, low expansion, and excellent optical transparency. It is widely used in semiconductor research, MEMS development, photonics, and university laboratory experiments.

Compared to natural quartz wafers, fused silica wafers offer higher purity, lower thermal expansion, and superior UV transmission, making them a preferred choice for advanced semiconductor and photonics applications.

Fused silica wafers are available in thicknesses ranging from 200 μm to 2 mm, with customized thicknesses provided for academic research and semiconductor R&D projects.

Common diameters include 2-inch, 4-inch, 6-inch, and 8-inch fused silica wafers, though custom sizes can be manufactured to meet the needs of university laboratories and industrial users.

Yes. Fused silica wafers have excellent thermal resistance up to 1000°C, ensuring reliable performance during high-temperature semiconductor fabrication, microfabrication, and optical device testing.

Yes. Fused silica wafers feature outstanding UV, visible, and IR transmission, making them ideal for optical research, photonics, lithography, and academic experiments.

Fused silica wafers are commonly used for MEMS fabrication, photomasks, semiconductor device prototyping, photonics, and optical sensors. Their high purity and stability make them especially valuable in university R&D labs.

Yes. Fused silica wafers are ideal for cleanroom environments because of their high purity, low particle generation, and contamination-free properties, making them widely used in semiconductor manufacturing and university research labs.

Absolutely. Fused silica wafers are a preferred substrate for MEMS fabrication due to their dimensional stability, low thermal expansion, and excellent optical transparency, enabling reliable micro-scale device development.

 

Fused silica wafers can be supplied single-side polished (SSP), double-side polished (DSP), or unpolished, depending on research and industrial applications. Polished wafers ensure high surface quality for photonics, optics, and lithography research.

 

They should be stored in protective wafer carriers within a clean, dry, and temperature-controlled environment to maintain purity and prevent scratches or contamination — essential for academic and R&D use.

 

Yes, fused silica offers excellent chemical resistance, making it suitable for semiconductor etching and cleaning processes. The only exception is hydrofluoric acid (HF), which can etch silica substrates.

 

For universities and research institutes, fused silica wafers deliver high-precision optical clarity, low expansion rates, and superior stability, making them valuable in nanotechnology, photonics, and semiconductor device research.

 

To ensure safe delivery, wafers are packed in anti-static wafer carriers with shock-absorbing materials, meeting the requirements of global semiconductor companies and university labs.

 

High-quality fused silica wafers can be sourced from specialized semiconductor material suppliers that serve both industrial manufacturers and academic research institutions worldwide, ensuring consistent quality and reliable performance.

Yes. We provide custom fused silica wafers with tailored diameters, thicknesses, surface finishes, and flatness levels, designed to meet the specific requirements of university laboratories, MEMS projects, and semiconductor R&D applications.

 

Customization includes wafer diameter, thickness, edge profile, surface polishing (single-side or double-side), and optical coatings. These options ensure the wafers meet the unique needs of academic research experiments, photonics development, and high-precision semiconductor processes.

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