Waffle Pack Chip Trays

Weeprofab supplies an extensive range of silicone sheets. This material is widely used for several applications due to its easy-to-manufacture and shaping process. It can be custom cut according to your needs to suit your requirements.

Waffle Pack Chip Trays

Weeprofab silicone sheets are an excellent elastomer. It offers excellent weathering and ozone resistance suitable for most demanding applications. Available in FDA and WRAS-approved grades ideal for the medical, food, and beverages industry. Weeprofab manufactures all types of silicone sheets for your applications. Whether you need silicone sponge sheets, fiberglass-reinforced silicone sheets, conductive silicone sheets, or clear silicone sheets, you can rely on Weeprofab. Our standard silicone sheets come in a variety of widths and lengths. This guarantees that you receive the ideal product for your requirements.

All sheets undergo strict quality control. Guaranteed high-quality, certified and versatile. Weeprofab support OEM and ODM services. All products are cost-effective, low MOQ, and easy to produce. Request full-rolls, custom shapes, cut-to-size, or custom thicknesses from Weeprofab.

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Faqs:

1. What chip types are suitable for waffle packs?
Ideal for:
    • BGA (Ball Grid Array) and QFP (Quad Flat Package) components.
    • RF/microwave chips, sensors, and MEMS devices.
    • Large – die or fragile components requiring secure containment.
    • Optoelectronic devices (e.g., lasers, photodiodes) sensitive to physical shock.
    • Measure the chip thickness + package height (e.g., for a 1.2mm – thick BGA, choose a 1.5mm – 2mm deep cavity to allow clearance).
    • Account for any protrusions (e.g., bond wires) to prevent damage during handling.
Yes, manufacturers offer custom tooling for:
    • Non – standard chip sizes (e.g., rectangular, irregular shapes).
    • Specialized cavities (e.g., angled walls for easier pick – and – place).
    • Branding (e.g., logo embossing, color coding).
    • Chamfered cavity edges to prevent chip snagging.
    • Latching lids or adhesive seals to secure chips during transit.
    • Anti – static interior coatings to minimize particle attraction.
    • Laser etching for permanent part numbers, lot codes, or QR codes.
    • RFID tags for automated inventory management.
    • Color – coded trays for quick visual identification.
    • Waffle packs: Rigid, reusable, and ideal for precise alignment in automation.
    • Gel packs: Soft, adhesive surfaces for temporary mounting of delicate dies, often used in die – attach processes.
Yes, when paired with:
    • Desiccant packets to control humidity.
    • Sealed bags (e.g., Mylar) to block oxygen and moisture.
    • Dark storage to prevent photodegradation of sensitive components.
Yes, key standards include:
    • JEDEC MO – 150: Defines tray dimensions and cavity layouts.
    • EIA – 583: Addresses ESD – safe packaging requirements.
    • SEMIF47: Specifies compatibility with automated handling equipment.
Yes, if designed with:
    • Snug – fitting cavities (tolerance <±0.05mm).
    • Vibration – dampening materials (e.g., rubberized inserts).
    • Secure locking mechanisms to prevent tray shifting during transit.

Typically 4 – 8 weeks for tooling and prototyping, with production runs of 4 – 6 weeks thereafter. Expedited options (e.g., 2 – week turnaround) may be available for urgent projects.

Yes, if made from outgassing – compliant materials (e.g., PEEK, ULTEM). These are tested to meet NASA or SEMI standards for low volatile emissions in vacuum chambers.

    • Measure the chip thickness + package height (e.g., for a 1.2mm – thick BGA, choose a 1.5mm – 2mm deep cavity to allow clearance).
    • Account for any protrusions (e.g., bond wires) to prevent damage during handling.
Yes, manufacturers offer custom tooling for:
    • Non – standard chip sizes (e.g., rectangular, irregular shapes).
    • Specialized cavities (e.g., angled walls for easier pick – and – place).
    • Branding (e.g., logo embossing, color coding).
    • Chamfered cavity edges to prevent chip snagging.
    • Latching lids or adhesive seals to secure chips during transit.
    • Anti – static interior coatings to minimize particle attraction.

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