Waffle Pack Chip Trays
Weeprofab supplies an extensive range of silicone sheets. This material is widely used for several applications due to its easy-to-manufacture and shaping process. It can be custom cut according to your needs to suit your requirements.
- 600° F / 315° C temperature rating
- Highly durable and long-lasting
- Great sealing capabilities
- Custom sizes available
Waffle Pack Chip Trays
Weeprofab silicone sheets are an excellent elastomer. It offers excellent weathering and ozone resistance suitable for most demanding applications. Available in FDA and WRAS-approved grades ideal for the medical, food, and beverages industry. Weeprofab manufactures all types of silicone sheets for your applications. Whether you need silicone sponge sheets, fiberglass-reinforced silicone sheets, conductive silicone sheets, or clear silicone sheets, you can rely on Weeprofab. Our standard silicone sheets come in a variety of widths and lengths. This guarantees that you receive the ideal product for your requirements.
All sheets undergo strict quality control. Guaranteed high-quality, certified and versatile. Weeprofab support OEM and ODM services. All products are cost-effective, low MOQ, and easy to produce. Request full-rolls, custom shapes, cut-to-size, or custom thicknesses from Weeprofab.
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Faqs:
1. What chip types are suitable for waffle packs?
- BGA (Ball Grid Array) and QFP (Quad Flat Package) components.
- RF/microwave chips, sensors, and MEMS devices.
- Large – die or fragile components requiring secure containment.
- Optoelectronic devices (e.g., lasers, photodiodes) sensitive to physical shock.
2. How do I choose the right cavity depth for my chips?
- Measure the chip thickness + package height (e.g., for a 1.2mm – thick BGA, choose a 1.5mm – 2mm deep cavity to allow clearance).
- Account for any protrusions (e.g., bond wires) to prevent damage during handling.
3. Can waffle packs be customized for unique chip geometries?
- Non – standard chip sizes (e.g., rectangular, irregular shapes).
- Specialized cavities (e.g., angled walls for easier pick – and – place).
- Branding (e.g., logo embossing, color coding).
4. What safety features do waffle packs include?
- Chamfered cavity edges to prevent chip snagging.
- Latching lids or adhesive seals to secure chips during transit.
- Anti – static interior coatings to minimize particle attraction.
5. How are waffle packs labeled for traceability?
- Laser etching for permanent part numbers, lot codes, or QR codes.
- RFID tags for automated inventory management.
- Color – coded trays for quick visual identification.
6. What's the difference between waffle packs and gel - pack carriers?
- Waffle packs: Rigid, reusable, and ideal for precise alignment in automation.
- Gel packs: Soft, adhesive surfaces for temporary mounting of delicate dies, often used in die – attach processes.
7. Can waffle packs be used for long - term chip storage?
- Desiccant packets to control humidity.
- Sealed bags (e.g., Mylar) to block oxygen and moisture.
- Dark storage to prevent photodegradation of sensitive components.
8. Are there industry standards for waffle pack dimensions?
- JEDEC MO – 150: Defines tray dimensions and cavity layouts.
- EIA – 583: Addresses ESD – safe packaging requirements.
- SEMIF47: Specifies compatibility with automated handling equipment.
9. Can waffle packs be used in high - vibration environments?
- Snug – fitting cavities (tolerance <±0.05mm).
- Vibration – dampening materials (e.g., rubberized inserts).
- Secure locking mechanisms to prevent tray shifting during transit.
10. What's the lead time for custom waffle pack orders?
Typically 4 – 8 weeks for tooling and prototyping, with production runs of 4 – 6 weeks thereafter. Expedited options (e.g., 2 – week turnaround) may be available for urgent projects.
11.Are waffle packs compatible with vacuum environments?
Yes, if made from outgassing – compliant materials (e.g., PEEK, ULTEM). These are tested to meet NASA or SEMI standards for low volatile emissions in vacuum chambers.
12. How do I choose the right cavity depth for my chips?
- Measure the chip thickness + package height (e.g., for a 1.2mm – thick BGA, choose a 1.5mm – 2mm deep cavity to allow clearance).
- Account for any protrusions (e.g., bond wires) to prevent damage during handling.
13. Can waffle packs be customized for unique chip geometries?
- Non – standard chip sizes (e.g., rectangular, irregular shapes).
- Specialized cavities (e.g., angled walls for easier pick – and – place).
- Branding (e.g., logo embossing, color coding).
14. What safety features do waffle packs include?
- Chamfered cavity edges to prevent chip snagging.
- Latching lids or adhesive seals to secure chips during transit.
- Anti – static interior coatings to minimize particle attraction.