Wafer Boat

Available in vertical & horizontal designs, our wafer boats cater to 8” & 12” wafers. Diverse materials—quartz for high-purity high-temp processes, SiC for thermal shock resistance, ceramics for wet etching—ensure optimal performance. Ideal for oxidation, diffusion, and CVD, with customizable slot pitches down to ±0.01mm. Trust our solutions to safeguard your wafers and drive scientific innovation.

What Is a Wafer Boat?

At its core, a wafer boat is a structured container with evenly spaced slots or grooves that secure semiconductor wafers (silicon, SiC, GaAs, etc.) in a fixed position during thermal or chemical processing. Its defining characteristics include:

    • Extreme Temperature Resistance: Operates reliably in furnaces up to 1,600 °C (depending on material), with minimal warping or degradation.

    • High Purity: Constructed from ultra-clean materials (≥99.99 % purity) to avoid contaminating wafers with particles or metal ions—critical for logic chips and power devices.

    • Precision Alignment: Slot spacing (typically 2–5 mm) and depth are calibrated to hold wafers vertically or horizontally without tilting, ensuring uniform heat distribution or coating.

    • Batch Compatibility: Holds 10–100+ wafers per unit, enabling efficient batch processing that reduces manufacturing time and cost.

Key Distinction: Wafer boats are for in-process use (exposed to heat, plasma, or chemicals), while wafer cassettes are for post-process storage/transport (room temperature only).

Core Types of Wafer Boats: Materials & Designs

By Material

Material Max Operating Temperature Key Properties Ideal Applications
Fused Quartz (SiO₂) 1,150–1,250 °C Ultra-high purity (<5 ppm metal impurities); low thermal expansion; transparent to UV/visible Standard silicon processing: diffusion, oxidation, low-temp epitaxy
Silicon Carbide (SiC) up to 1,600 °C Exceptional thermal shock resistance; high mechanical strength; resistant to harsh acids/gases Advanced high-temperature processes: SiC wafer annealing, high-power CVD
Silicon (Poly/Mono) ~1,000–1,100 °C Wafer-matched thermal expansion; no lattice mismatch with silicon wafers Silicon-on-silicon epitaxy, high-purity annealing
Aluminum Oxide (Al₂O₃) 1,300–1,400 °C Cost-effective; good chemical stability; moderate purity Low-to-mid temperature processes: wafer cleaning, solar PV diffusion

Industry data show fused quartz wafer boats dominate ~70–75 % of the market because of their versatility and compatibility with mainstream silicon fabs.

By Design

Design Type Key Features Wafer Size Compatibility Furnace Type
Vertical Slot Boat Slots oriented vertically; stackable for space efficiency 4–12 inches Vertical furnaces (high-volume production)
Horizontal Slot Boat Slots oriented horizontally; open-top for easy wafer loading 2–6 inches Horizontal furnaces (small-batch R&D, custom wafers)
Custom Grooved Boat Tailored slot width/depth; rounded edges to prevent wafer chipping; optional push-pull rods Any size (2–12 inches) Thin wafers (<100 μm), compound semiconductors (GaAs, GaN), or specialty processes

Critical Specifications for Wafer Boats

1. Wafer Size & Capacity

Wafer Diameter Typical Slot Width Capacity (Per Boat)
4 inches (100 mm) 102–105 mm 25–50 wafers
6 inches (150 mm) 152–155 mm 20–40 wafers
8 inches (200 mm) 203–206 mm 15–30 wafers
12 inches (300 mm) 305–308 mm 10–20 wafers

2. Quality Metrics

Metric Definition Typical Range (Quartz) Impact
Slot Precision Uniformity of slot width/depth across the boat ±0.1–0.2 mm Prevents wafer pinching or loose fitting
Surface Roughness (Ra) Smoothness of slot surfaces <0.5 µm Prevents wafer scratches or particle shedding
Impurity Level Metal/oxide contaminants in the material <5 ppm (total metals) Avoids doping or contamination of wafers

Key Applications: Where Wafer Boats Add Value

1. Silicon Wafer Processing

    • Diffusion: Fused quartz boats hold wafers during dopant diffusion (e.g., boron/phosphorus) at 900–1,100 °C, with high purity preventing dopant cross-contamination.

    • Oxidation: Vertical slot boats ensure wafers are evenly exposed to oxygen/steam, creating uniform SiO₂ layers.

2. Compound Semiconductor Processing

    • GaN/SiC Wafers: SiC or high-purity quartz boats withstand the 1,200–1,600 °C temperatures needed for GaN/SiC epitaxy, with thermal stability preventing wafer warping.

    • GaAs Wafers: Custom grooved silicon boats (matched to GaAs thermal expansion) reduce chipping during low-temperature annealing (800–900 °C).

3. Specialty Applications

    • Thin Wafer Processing: Ultra-thin wafers (<50 μm) require custom boats with soft, rounded slots to avoid breakage.

    • Solar PV Wafers: Cost-effective aluminum oxide boats hold silicon PV wafers during diffusion, balancing performance and budget.

How to Select the Right Wafer Boat?

1. Pick the Right Material:

• High-temperature processes (>1,200 °C): SiC boats.
• Standard silicon processes: Fused quartz boats.
• Cost-sensitive mid-temp processes: Aluminum oxide boats.

2. Match Design to Furnace & Batch Size:

• Vertical furnaces: Vertical slot boats.
• Horizontal furnaces: Horizontal slot boats.
• Thin/odd-sized wafers: Custom grooved boats with rounded edges.

3. Verify Wafer Size & Capacity:

• Ensure slot width is slightly larger than wafer diameter.
• Choose capacity based on batch needs.

Why Choose Us – Custom Wafer Boat Solutions?

Beyond standard wafer boats, we provide customized services to match your exact process. This includes custom slot counts and spacing, push-pull rod interfaces, material grade selection, surface/edge polishing, traceability certificates, and rapid prototyping.

These properties make our wafer boats ideal for high-temperature and high-frequency devices where silicon cannot perform. We can also provide fully customized services—please contact us for support.

Maintenance Tips to Extend Wafer Boat Life

    • Prevent Thermal Shock: Preheat boats to 200–300 °C before inserting into high-temp furnaces; cool down gradually.

    • Regular Cleaning: For quartz boats, use a mild HF acid bath followed by DI rinse every 2–3 weeks.

    • Inspect Before Use: Check for cracks, warped slots, or particle buildup.

    • Proper Storage: Store in a clean, dry environment (Class 100 cleanroom recommended) with protective sleeves.

FAQs:

1. Can I customize wafer boats with special sizes or structures?

Customization is available. Provide wafer size, process parameters, and special functional requirements (e.g., built-in sensors)

High-purity quartz is ideal for high-temperature clean processes like oxidation and diffusion; silicon carbide, with its excellent wear resistance, suits high-frequency thermal cycling; ceramic alloys perform best in highly corrosive environments such as wet etching. 

Ensure the slot pitch and loading capacity match the wafer size. Also, consider process temperature, corrosiveness, and choose the appropriate material and structure accordingly.

Quartz materials can withstand up to 1200°C, while silicon carbide can endure temperatures above 1600°C. Refer to the product specification for precise details.

High-purity quartz (99.99%) and special ceramic materials have strong chemical stability, with minimal impurity release under normal usage. 

Not recommended to avoid cross-contamination. If necessary, ensure the wafers have non-reactive surfaces and compatible process conditions. 

After high-temperature processes, soak it in a diluted hydrofluoric acid (HF) solution to remove residues. For wet processes, rinse with deionized water and dry thoroughly.

It depends on usage frequency, temperature, and corrosiveness. Generally, quartz boats last 50-100 high-temperature cycles, while silicon carbide boats last longer.

Most wafer boats support vacuum processes, but verify the material’s stability under vacuum and high temperatures. 

Choose products with precise slot pitch (±0.01mm) and anti-slip inner walls. Ensure wafers are fully seated during loading.

Most models are designed for robotic arm compatibility. When purchasing, confirm that the interface size and gripping points match.

They combine the properties of multiple materials, such as the thermal stability of quartz and the mechanical strength of ceramics, fitting complex process requirements.

Use anti-static, scratch-resistant packaging boxes. Store in a dry, dust-free environment, avoiding heavy pressure and collisions.

Minor scratches have little impact, but deep ones may trap contaminants. Regularly inspect and replace severely damaged boats.

Check the size, slot type, and interface standards. Products compliant with SEMI specifications have higher compatibility. 

Check the size, slot type, and interface standards. Products compliant with SEMI specifications have higher compatibility. 

Yes, preheat it to 50%-70% of the process temperature before high-temperature processes to prevent thermal shock caused by large temperature differences.

The warranty period is usually 6-12 months, covering material defects and structural damages caused by non-human factors.

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