Wafer Separator

Weeprofab supplies an extensive range of silicone sheets. This material is widely used for several applications due to its easy-to-manufacture and shaping process. It can be custom cut according to your needs to suit your requirements.

Silicone Sheet Supplier - Weeprofab

Weeprofab silicone sheets are an excellent elastomer. It offers excellent weathering and ozone resistance suitable for most demanding applications. Available in FDA and WRAS-approved grades ideal for the medical, food, and beverages industry. Weeprofab manufactures all types of silicone sheets for your applications. Whether you need silicone sponge sheets, fiberglass-reinforced silicone sheets, conductive silicone sheets, or clear silicone sheets, you can rely on Weeprofab. Our standard silicone sheets come in a variety of widths and lengths. This guarantees that you receive the ideal product for your requirements.

All sheets undergo strict quality control. Guaranteed high-quality, certified and versatile. Weeprofab support OEM and ODM services. All products are cost-effective, low MOQ, and easy to produce. Request full-rolls, custom shapes, cut-to-size, or custom thicknesses from Weeprofab.

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Faqs:

1. What wafer sizes are compatible with Wafer Separators?
Most separators support standard sizes:
    • 2″, 4″, 6″, 8″, 12″ (300mm)
    • Custom adapters can be configured for non – standard sizes (e.g., 18″, 200mm GaAs wafers).
Yes, most separators are designed for:
    • ISO Class 5 (Class 100) cleanrooms
    • ESD – safe materials and grounding
    • Minimal particle emission (tested to <0.1 particles/ft³ for ≥0.5μm)
Key selection criteria:
    1. Wafer material (Si, GaAs, SiC, etc.)
    2. Thickness (standard vs. thin wafers)
    3. Throughput requirements
    4. Cleanroom class compatibility
    5. Integration with existing handling systems
    • Standard systems: 10 – 20 wafers/minute
    • High – speed models: Up to 50 wafers/minute
    • Throughput varies by wafer size and separation technology.
Yes, specialized separators for thin wafers (down to 50μm) feature:
    • Vacuum – assisted lifting with uniform pressure distribution
    • Edge – support mechanisms to prevent warping
    • Low – profile design to reduce vertical stress
Regular maintenance includes:
    • Cleaning contact surfaces (weekly)
    • Replacing wear parts (vacuum cups, grippers) quarterly
    • Calibrating vision systems annually
    • Lubricating mechanical components per manufacturer guidelines
Yes, separators can interface with:
    • Robotic arms (SCARA, delta robots)
    • Conveyor systems
    • PLC control systems
    • Industry 4.0 protocols (OPC UA, MQTT)
Specialized features for warped wafers:
    • Flexible gripper designs that adapt to wafer curvature
    • Multi – point vacuum suction to distribute force evenly
    • Pre – alignment stations to correct minor warping
Yes:
    • Recyclable PP/PE materials
    • Biodegradable separators (starch – based polymers)
    • Reusable separators that reduce waste by 80% over disposable types
Yes, but material compatibility matters:
    • Silicon (Si): PP/PE separators are standard
    • GaAs/InP: Anti – static PI separators to prevent corrosion
    • Sapphire/Glass: Teflon separators for chemical resistance
Typical thickness ranges:
    • 50μm – 200μm (0.05mm – 0.2mm)
    • Thin separators (50 – 100μm) for tight – stack cassettes
    • Thick separators (150 – 200μm) for added protection in transit
No, high – quality separators are:
    • Dimensionally stable (thermal expansion <50ppm/°C)
    • Non – hygroscopic (moisture absorption <0.1%)
    • Flatness tolerance within ±50μm over the entire surface
    • Sealed in anti – static bags
    • Stored in temperature – controlled environments (23±3°C, 45±5% RH)
    • Avoid direct sunlight or exposure to organic solvents
    • Stacked flat to prevent warping
Reusability depends on material and condition:
    • Polypropylene/PE: Reusable if undamaged (clean with IPA between uses)
    • Paper – based separators: Disposable
    • Polyimide: Reusable in high – temperature applications (up to 260°C)
    • Physical barrier between wafers to avoid edge chipping
    • Anti – static properties to minimize ESD damage
    • Low – outgassing materials to prevent chemical contamination
    • Smooth surface finish (Ra < 1μm) to reduce particle generation

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