Wafer Separator

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Wafer Separator​ Manufacturer & Supplier - Supwafer

For semiconductor labs, research facilities, and production plants worldwide, the challenge of precise, damage-free wafer separation is non-negotiable. Whether you’re handling fragile thin wafers, high-value compound semiconductors, or large-diameter substrates, the margin for error is zero—and that’s where Supwafer steps in.

 

As a leading manufacturer and supplier of wafer separators, Supwafer combines decades of semiconductor expertise with cutting-edge engineering to deliver solutions that set industry standards. Our wafer separators are designed to streamline your workflow, minimize yield loss, and adapt to the most demanding applications—from R&D prototyping in academic labs to high-volume production in fabs.

Why Supwafer Wafer Separators?

The charges accumulated on products such as wafers placed on the wafer pad can be well discharged through the bag body, which can protect electronic sensitive components from damage by electromagnetic waves and static electricity.
    • The surface resistivity can be adjusted between 10³ and 10¹¹ ohms as required;
    • Can be made into any size and shape according to customer requirements
      Regular sizes: Round sheets: 5 inches, 6 inches, 7 inches, 8 inches, 9 inches, 10 inches, 12 inches, 14 inches; Square sheets: 2 inches, 3 inches and 5 inches
    • Excellent stability, flat surface, no powder shedding or dust generation;
    • Has good rigidity, toughness, as well as favorable tensile strength and impact resistance;
    • Adapts to a relatively wide range of ambient temperatures;
    • Static discharge time: <1.0sec
    • Versatility for Diverse Substrates: Whether you work with silicon, GaAs, SiC, sapphire, or advanced materials, our separators are customizable to match material hardness, thickness (down to 50μm), and coating requirements. Ideal for both rigid and flexible wafer handling.
    • Automation & Integration: Designed for seamless integration with existing lab setups or production lines. Choose from manual, semi-automatic, or fully automated models with intuitive controls, programmable parameters, and compatibility with Industry 4.0 systems for enhanced process traceability.
    • Reliability Backed by Expertise: Every Supwafer separator undergoes rigorous testing in our in-house semiconductor labs, validated by industry experts. We offer global technical support, rapid spare parts delivery, and on-site training to ensure maximum uptime for your operations.

High Gloss and No Powder Shedding

Supwafer’s wafer separators deliver critical surface performance with high gloss and no powder shedding, engineered for precision semiconductor processing. The high-gloss finish ensures ultra-smooth wafer contact, preventing micro-abrasions on sensitive substrates like SiC and enhancing inspection accuracy. Its no-powder-shedding design, via wear-resistant materials and precision coatings, eliminates particle contamination—critical for advanced nodes and high-reliability devices—while meeting SEMI cleanroom standards to safeguard yield and process integrity.

Different shapes of wafer separators

Round Wafer Separators​

Round Wafer Separators

Round Wafer Separators are precision-engineered for 2” to 12” circular wafers, leveraging shape-specific design to minimize stress and ensure uniformity—outperforming multi-shape systems in high-precision workflows.
    • Contour-Matched Handling: Circular surfaces distribute pressure evenly, reducing warpage in thin (≤50μm) substrates.
    • Radial Control: Optimized concentric separation paths align with dicing saw needs for full-wafer processing.
    • Edge Protection: Rounded tooling prevents micro-cracks in brittle materials (e.g., SiC), boosting die yield.
    • Standard Compatibility: Pre-calibrated for standard circular sizes, cutting setup time in fabs.
 

Square Wafer Separators

Square Wafer Separators are specialized for 2” to 5” square substrates, with design elements tailored to their angular geometry—ensuring precise handling where rectangular alignment and edge stability are critical.
    • Corner Stress Reduction: Reinforced tooling at corners minimizes chipping in square substrates, a key issue in angular wafer processing.
    • Edge-to-Edge Uniformity: Linear separation paths optimize alignment for square-specific dicing patterns, common in display and sensor fabrication.
    • Custom Fit for Square Formats: Pre-configured for standard square sizes, cutting setup time in PCB and optoelectronic production lines.
    • Rigid Edge Support: Enhanced clamping at straight edges prevents flexing in thin square wafers, vital for GaN-based power device manufacturing.
 
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Supwafer is a wafer separator factory from China. If you are interested in wholesaling wafer separators, please feel free to contact us to get the wholesale pricelist.

Faqs:

1. What wafer sizes are compatible with Wafer Separators?
Most separators support standard sizes:
    • 2″, 4″, 6″, 8″, 12″ (300mm)
    • Custom adapters can be configured for non – standard sizes (e.g., 18″, 200mm GaAs wafers).
Yes, most separators are designed for:
    • ISO Class 5 (Class 100) cleanrooms
    • ESD – safe materials and grounding
    • Minimal particle emission (tested to <0.1 particles/ft³ for ≥0.5μm)
Key selection criteria:
    1. Wafer material (Si, GaAs, SiC, etc.)
    2. Thickness (standard vs. thin wafers)
    3. Throughput requirements
    4. Cleanroom class compatibility
    5. Integration with existing handling systems
    • Standard systems: 10 – 20 wafers/minute
    • High – speed models: Up to 50 wafers/minute
    • Throughput varies by wafer size and separation technology.
Yes, specialized separators for thin wafers (down to 50μm) feature:
    • Vacuum – assisted lifting with uniform pressure distribution
    • Edge – support mechanisms to prevent warping
    • Low – profile design to reduce vertical stress
Regular maintenance includes:
    • Cleaning contact surfaces (weekly)
    • Replacing wear parts (vacuum cups, grippers) quarterly
    • Calibrating vision systems annually
    • Lubricating mechanical components per manufacturer guidelines
Yes, separators can interface with:
    • Robotic arms (SCARA, delta robots)
    • Conveyor systems
    • PLC control systems
    • Industry 4.0 protocols (OPC UA, MQTT)
Specialized features for warped wafers:
    • Flexible gripper designs that adapt to wafer curvature
    • Multi – point vacuum suction to distribute force evenly
    • Pre – alignment stations to correct minor warping
Yes:
    • Recyclable PP/PE materials
    • Biodegradable separators (starch – based polymers)
    • Reusable separators that reduce waste by 80% over disposable types
Yes, but material compatibility matters:
    • Silicon (Si): PP/PE separators are standard
    • GaAs/InP: Anti – static PI separators to prevent corrosion
    • Sapphire/Glass: Teflon separators for chemical resistance
Typical thickness ranges:
    • 50μm – 200μm (0.05mm – 0.2mm)
    • Thin separators (50 – 100μm) for tight – stack cassettes
    • Thick separators (150 – 200μm) for added protection in transit
No, high – quality separators are:
    • Dimensionally stable (thermal expansion <50ppm/°C)
    • Non – hygroscopic (moisture absorption <0.1%)
    • Flatness tolerance within ±50μm over the entire surface
    • Sealed in anti – static bags
    • Stored in temperature – controlled environments (23±3°C, 45±5% RH)
    • Avoid direct sunlight or exposure to organic solvents
    • Stacked flat to prevent warping
Reusability depends on material and condition:
    • Polypropylene/PE: Reusable if undamaged (clean with IPA between uses)
    • Paper – based separators: Disposable
    • Polyimide: Reusable in high – temperature applications (up to 260°C)
    • Physical barrier between wafers to avoid edge chipping
    • Anti – static properties to minimize ESD damage
    • Low – outgassing materials to prevent chemical contamination
    • Smooth surface finish (Ra < 1μm) to reduce particle generation

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