Wafer Separator
Supwafer provides high-purity wafer separators for semiconductor fabs, R&D labs and cleanrooms.
Our separators are engineered to protect thin silicon, GaAs, SiC, sapphire and compound semiconductor wafers during storage, transport and high-temperature processing.They combine ESD-safe properties, low particle generation and tight thickness tolerances to ensure your wafers remain intact and contamination-free.
- Custom static-dissipative ranges to match your ESD requirements.
- Ultra-thin wafer protection: separators designed for ≤ 50 µm wafers prevent edge chipping and backside contamination.
- Global supply experience: universities, research labs and leading fabs worldwide use Supwafer separators.
- Cleanroom certified materials tested under ISO 14644.
Wafer Separator Manufacturer & Supplier - Supwafer
Why Supwafer Wafer Separators?
High Gloss and No Powder Shedding
Supwafer’s wafer separators deliver critical surface performance with high gloss and no powder shedding, engineered for precision semiconductor processing. The high-gloss finish ensures ultra-smooth wafer contact, preventing micro-abrasions on sensitive substrates like SiC and enhancing inspection accuracy. Its no-powder-shedding design, via wear-resistant materials and precision coatings, eliminates particle contamination—critical for advanced nodes and high-reliability devices—while meeting SEMI cleanroom standards to safeguard yield and process integrity.
Different shapes of wafer separators
Round Wafer Separators
- Contour-Matched Handling: Circular surfaces distribute pressure evenly, reducing warpage in thin (≤50μm) substrates.
- Radial Control: Optimized concentric separation paths align with dicing saw needs for full-wafer processing.
- Edge Protection: Rounded tooling prevents micro-cracks in brittle materials (e.g., SiC), boosting die yield.
- Standard Compatibility: Pre-calibrated for standard circular sizes, cutting setup time in fabs.
Square Wafer Separators
- Corner Stress Reduction: Reinforced tooling at corners minimizes chipping in square substrates, a key issue in angular wafer processing.
- Edge-to-Edge Uniformity: Linear separation paths optimize alignment for square-specific dicing patterns, common in display and sensor fabrication.
- Custom Fit for Square Formats: Pre-configured for standard square sizes, cutting setup time in PCB and optoelectronic production lines.
- Rigid Edge Support: Enhanced clamping at straight edges prevents flexing in thin square wafers, vital for GaN-based power device manufacturing.
Supwafer is a wafer separator factory from China. If you are interested in wholesaling wafer separators, please feel free to contact us to get the wholesale pricelist.
Applications
1. Semiconductor Fabrication
Prevent wafer-to-wafer contact in cassettes, FOUPs and carriers during high-temperature diffusion, implantation or cleaning.
2. Thin Wafer Handling
Ideal for MEMS, advanced packaging and 3D integration where ultra-thin wafers need mechanical support.
3. Compound Semiconductor & Sapphire
Protect expensive GaAs, SiC and sapphire wafers during grinding, polishing, lapping and shipping.
4. Photonics & Optoelectronics
Maintain scratch-free surfaces on optical substrates and filters.
Key Features & Specifications
| Parameter | Typical Value / Option |
|---|---|
| Material | High-purity static-dissipative polymer / fused quartz / custom composite |
| Temperature rating | Up to 315 °C (600 °F) |
| Surface resistivity (ESD safe) | 10³–10¹¹ Ω/sq (custom ranges on request) |
| Thickness & tolerance | 50 µm–500 µm (±5–10 µm typical) |
| Flatness / TTV | ≤15 µm across separator (standard), tighter on request |
| Particle release (ISO 14644) | Class 100 / Class 10 cleanroom compatible |
| Shapes & sizes | Round (100–300 mm), Square, custom |
| Edge finish | Reinforced / beveled edges for ≤50 µm thin wafers |
Technical Details
Material Science: We use high-purity polymers with low ionic contamination; for high-temperature applications fused quartz separators are available.
ESD Safety: Each batch tested using ANSI/ESD STM11.11; surface resistivity reports attached to CoA.
Thickness & Flatness Control: Separator thickness tolerance as tight as ±5 µm measured by non-contact metrology.
Cleanroom Compliance: Particle generation tested per IEST-STD-CC1246.
Customization: Edge profiles, hole patterns, and anti-slip textures can be specified.
How to Choose the Right Wafer Separator?
Match Wafer Diameter – 100, 150, 200, 300 mm or custom.
Select Material & Temperature Rating – polymer vs. fused quartz.
Define Surface Resistivity – 10³–10⁹ Ω/sq for dissipative, >10¹¹ Ω/sq for insulating.
Specify Thickness Tolerance & Flatness – especially for ≤50 µm thin wafers.
Request Test Data – Supwafer provides CoA, surface resistivity maps and particle counts.
Faqs:
1. What wafer sizes are compatible with Wafer Separators?
2. Are Wafer Separators compatible with cleanroom environments?
3. How do I choose the right Wafer Separator for my application?
4. What is the typical throughput of a Wafer Separator?
5. Can Wafer Separators handle thin or fragile wafers?
6. What maintenance is required for Wafer Separators?
7. Can Wafer Separators be integrated with automated production lines?
8. How do Wafer Separators handle warped or non - flat wafers?
9. Are there eco - friendly Wafer Separator options?
10. Can Wafer Separators be used for all semiconductor materials?
11. How thick are Wafer Separators?
12. Do Wafer Separators affect wafer flatness?
13. How should Wafer Separators be stored?
14. Can Wafer Separators be reused?
15. How do Wafer Separators prevent wafer damage?
REQUEST A QUOTE
Our professional team will reply to you within one business day. Please feel free to contact us!
